Soldering-based heat dissipation solutions for electronic devices
Solve thermal issues in electronic devices! Improve heat dissipation performance with soldering technology.
In the electronics industry, as miniaturization and high density progress, heat dissipation measures have become an important issue. In particular, efficiently dissipating heat from heat sources such as CPUs and GPUs is essential for maintaining product performance and improving reliability. Poor heat dissipation can lead to device malfunctions and reduced lifespan. Our brazing technology provides effective heat dissipation solutions by joining non-ferrous metals such as copper, brass, and aluminum, achieving high thermal conductivity. 【Application Scenarios】 - CPU heat sinks - GPU coolers - Power amplifiers - LED lighting 【Benefits of Implementation】 - Improved heat dissipation performance - Extended product lifespan - Stable operation of devices - Contribution to miniaturization and lightweighting of products
- 企業：松井製作所
- 価格：Other
